Through-Hole OGN Fuse Holder for Fully Automated PCB assembly
* Suitable for fully automated PCB assembly
* Reflow capable
* Fully backwards compatible with OGN for THT
* Available with blister tape packaging
The Schhurter OGN fuse holder is a product that has proven itself over decades and has been continuously improved and expanded with new variants. It started with a THT version (Through-Hole Technology), followed by one for SMT (Surface-Mounting Technology). Now Schurter is introducing a third option, which closes the last gap: THR (Through-Hole Reflow).
Highly integrated electronic circuits are almost exclusively assembled with SMT components and soldered in a reflow oven. However, it is sometimes necessary to include THT components on the circuit board. This has a decisive disadvantage: THT components need to be soldered differently, a second soldering process is necessary.
The Solution: THR
In fact, THR components are through-hole components. They are specially designed for automated assembly and high thermal stress in the reflow oven. During the assembly process, a paste is first printed into the vias for the THT pins, and then the component is pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias due to wetting and capillary forces and forms the solder joint.
OGN: The Classic
The open fuse holder OGN is designed for 5×20 fuses of various types. It naturally complies with the tightened rules of glow wire resistance according to IEC 60335-1. If desired, it can be converted into a closed fuse holder by means of an optionally available cover.
Preassembled Variants to Follow:
In the near future Schurter will offer the OGN for THR pre-assembled with a 5×20 fuse in blister packaging (tape & reel). This according to customer requirements for fully automated PCB assembly. Just as Schurter is already doing with the OGN for SMT today.
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